Diff: TMP006.cpp

Revision:

0:48c0564d877a

--- /dev/null	Thu Jan 01 00:00:00 1970 +0000
+++ b/TMP006.cpp	Wed Oct 16 19:59:52 2013 +0000
@@ -0,0 +1,123 @@
+#include "TMP006.h"
+ 
+#define TEMP_REG_ADDR 0x00
+ 
+TMP006::TMP006(PinName sda, PinName scl, int addr) : m_i2c(sda, scl), m_addr(addr) {
+}
+ 
+TMP006::~TMP006() { 
+}
+
+
+/** TMP006 Config method.
+ *  Used for configuring the sensor with desired samples.
+ */
+void TMP006::config(uint8_t addr, uint16_t samples)
+{
+    char    data[2];
+
+    data[0]   = 0x02;
+    data[1]   = samples | TMP006_CFG_MODEON | TMP006_CFG_DRDYEN;
+
+    m_i2c.write( addr, data, 1 ); // writes the config (0x02) address with the sample rate
+  
+}
+
+/** TMP006 Read Raw Temperature method.
+ *  Used for getting the raw data off the chip.
+ */
+int16_t TMP006::readRawDieTemperature(uint8_t addr)
+{
+
+  char reg[1];
+  char data[2];
+  
+  reg[0] = TMP006_TAMB;
+  
+  m_i2c.write(addr, reg, 1);
+  m_i2c.read(addr, data, 2);
+   
+  int16_t raw = (data[0] << 8) | data[1] ;
+
+  raw >>= 2;
+  return raw;
+}
+
+/** TMP006 Read Raw Voltage method.
+ *  Used for reading the raw voltage from the thermopile.
+ */
+int16_t TMP006::readRawVoltage(uint8_t addr) 
+{  
+  char reg[1];
+  char data[2];
+  
+  reg[0] = TMP006_VOBJ;
+  
+  m_i2c.write(addr, reg, 1);
+  m_i2c.read(addr, data, 2);
+   
+  int16_t raw = (data[0] << 8) | data[1] ;
+  
+  return raw;
+}
+
+/** TMP006 Read Object Temperature(C) method.
+ *  Used for calculating the object temperature in celcius.
+ */
+double TMP006::readObjTempC(uint8_t addr) 
+{
+  double Tdie = readRawDieTemperature(addr);
+  double Vobj = readRawVoltage(addr);
+  Vobj *= 156.25;  // 156.25 nV per LSB
+  Vobj /= 1000000000; // nV -> V
+  Tdie *= 0.03125; // convert to celsius
+  Tdie += 273.15; // convert to kelvin
+
+  // Equations for calculating temperature found in section 5.1 in the user guide
+  double tdie_tref = Tdie - TMP006_TREF;
+  double S = (1 + TMP006_A1*tdie_tref + 
+      TMP006_A2*tdie_tref*tdie_tref);
+  S *= TMP006_S0;
+  S /= 10000000;
+  S /= 10000000;
+
+  double Vos = TMP006_B0 + TMP006_B1*tdie_tref + 
+    TMP006_B2*tdie_tref*tdie_tref;
+
+  double fVobj = (Vobj - Vos) + TMP006_C2*(Vobj-Vos)*(Vobj-Vos);
+
+  double Tobj = sqrt(sqrt(Tdie * Tdie * Tdie * Tdie + fVobj/S));
+
+  Tobj -= 273.15; // Kelvin -> *C
+  return Tobj;
+}
+
+/** TMP006 Read Object Temperature(F) method.
+ *  Used for calculating the object temperature in fahrenheit.
+ */
+double TMP006::readObjTempF(uint8_t addr) 
+{
+  double Tobj = readObjTempC(addr);
+  Tobj = Tobj * 9.0/5.0 + 32.0; // convert to fahrenheit
+  return Tobj;
+}
+
+/** TMP006 Read Die Temperature(C) method.
+ *  Used for calculating the die temperature in celcius.
+ */
+double TMP006::readDieTempC(uint8_t addr) 
+{
+  double Tdie = readRawDieTemperature(addr);
+  Tdie *= 0.03125; // convert to celsius
+  return Tdie;
+}
+
+/** TMP006 Read Die Temperature(F) method.
+ *  Used for calculating the die temperature in fahrenheit.
+ */
+double TMP006::readDieTempF(uint8_t addr) 
+{
+  double Tdie = readDieTempC(addr);
+  Tdie = Tdie * 9.0/5.0 + 32.0; // convert to fahrenheit
+  return Tdie;
+}