These are the methods to interface the TMP006 sensor with the mbed controller.
Dependents: mbed_blinky_Tmp006_No2 mbed_blinky_Tmp006_3rd completesensor TMP006IR_HelloWorld
Diff: TMP006.cpp
- Revision:
- 0:48c0564d877a
--- /dev/null Thu Jan 01 00:00:00 1970 +0000 +++ b/TMP006.cpp Wed Oct 16 19:59:52 2013 +0000 @@ -0,0 +1,123 @@ +#include "TMP006.h" + +#define TEMP_REG_ADDR 0x00 + +TMP006::TMP006(PinName sda, PinName scl, int addr) : m_i2c(sda, scl), m_addr(addr) { +} + +TMP006::~TMP006() { +} + + +/** TMP006 Config method. + * Used for configuring the sensor with desired samples. + */ +void TMP006::config(uint8_t addr, uint16_t samples) +{ + char data[2]; + + data[0] = 0x02; + data[1] = samples | TMP006_CFG_MODEON | TMP006_CFG_DRDYEN; + + m_i2c.write( addr, data, 1 ); // writes the config (0x02) address with the sample rate + +} + +/** TMP006 Read Raw Temperature method. + * Used for getting the raw data off the chip. + */ +int16_t TMP006::readRawDieTemperature(uint8_t addr) +{ + + char reg[1]; + char data[2]; + + reg[0] = TMP006_TAMB; + + m_i2c.write(addr, reg, 1); + m_i2c.read(addr, data, 2); + + int16_t raw = (data[0] << 8) | data[1] ; + + raw >>= 2; + return raw; +} + +/** TMP006 Read Raw Voltage method. + * Used for reading the raw voltage from the thermopile. + */ +int16_t TMP006::readRawVoltage(uint8_t addr) +{ + char reg[1]; + char data[2]; + + reg[0] = TMP006_VOBJ; + + m_i2c.write(addr, reg, 1); + m_i2c.read(addr, data, 2); + + int16_t raw = (data[0] << 8) | data[1] ; + + return raw; +} + +/** TMP006 Read Object Temperature(C) method. + * Used for calculating the object temperature in celcius. + */ +double TMP006::readObjTempC(uint8_t addr) +{ + double Tdie = readRawDieTemperature(addr); + double Vobj = readRawVoltage(addr); + Vobj *= 156.25; // 156.25 nV per LSB + Vobj /= 1000000000; // nV -> V + Tdie *= 0.03125; // convert to celsius + Tdie += 273.15; // convert to kelvin + + // Equations for calculating temperature found in section 5.1 in the user guide + double tdie_tref = Tdie - TMP006_TREF; + double S = (1 + TMP006_A1*tdie_tref + + TMP006_A2*tdie_tref*tdie_tref); + S *= TMP006_S0; + S /= 10000000; + S /= 10000000; + + double Vos = TMP006_B0 + TMP006_B1*tdie_tref + + TMP006_B2*tdie_tref*tdie_tref; + + double fVobj = (Vobj - Vos) + TMP006_C2*(Vobj-Vos)*(Vobj-Vos); + + double Tobj = sqrt(sqrt(Tdie * Tdie * Tdie * Tdie + fVobj/S)); + + Tobj -= 273.15; // Kelvin -> *C + return Tobj; +} + +/** TMP006 Read Object Temperature(F) method. + * Used for calculating the object temperature in fahrenheit. + */ +double TMP006::readObjTempF(uint8_t addr) +{ + double Tobj = readObjTempC(addr); + Tobj = Tobj * 9.0/5.0 + 32.0; // convert to fahrenheit + return Tobj; +} + +/** TMP006 Read Die Temperature(C) method. + * Used for calculating the die temperature in celcius. + */ +double TMP006::readDieTempC(uint8_t addr) +{ + double Tdie = readRawDieTemperature(addr); + Tdie *= 0.03125; // convert to celsius + return Tdie; +} + +/** TMP006 Read Die Temperature(F) method. + * Used for calculating the die temperature in fahrenheit. + */ +double TMP006::readDieTempF(uint8_t addr) +{ + double Tdie = readDieTempC(addr); + Tdie = Tdie * 9.0/5.0 + 32.0; // convert to fahrenheit + return Tdie; +}