Diff: nRF51822/nordic/ble_bondmngr_cfg.h

Revision:

0:76dfa9657d9d

--- /dev/null	Thu Jan 01 00:00:00 1970 +0000
+++ b/nRF51822/nordic/ble_bondmngr_cfg.h	Wed Nov 12 02:40:34 2014 +0000
@@ -0,0 +1,35 @@
+/* Copyright (c) 2012 Nordic Semiconductor. All Rights Reserved.
+ *
+ * The information contained herein is property of Nordic Semiconductor ASA.
+ * Terms and conditions of usage are described in detail in NORDIC
+ * SEMICONDUCTOR STANDARD SOFTWARE LICENSE AGREEMENT.
+ *
+ * Licensees are granted free, non-transferable use of the information. NO
+ * WARRANTY of ANY KIND is provided. This heading must NOT be removed from
+ * the file.
+ *
+ */
+
+ /** @cond To make doxygen skip this file */
+ 
+/** @file
+ *
+ * @defgroup ble_sdk_app_gls_bondmngr_cfg GLS Bond Manager Configuration
+ * @{
+ * @ingroup ble_sdk_app_gls
+ * @brief Definition of bond manager configurable parameters
+ */
+
+#ifndef BLE_BONDMNGR_CFG_H__
+#define BLE_BONDMNGR_CFG_H__
+
+/**@brief Number of CCCDs used in the GLS application. */
+#define BLE_BONDMNGR_CCCD_COUNT            2
+
+/**@brief Maximum number of bonded centrals. */
+#define BLE_BONDMNGR_MAX_BONDED_CENTRALS   7
+
+#endif // BLE_BONDMNGR_CFG_H__
+
+/** @} */
+/** @endcond */