AndroidのBLEラジコンプロポアプリ「BLEPropo」と接続し、RCサーボとDCモータを制御するプログラムです。 mbed HRM1017で動作を確認しています。 BLEPropo → https://github.com/lipoyang/BLEPropo
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BLEを使ったAndroid用ラジコンプロポアプリ「BLEPropo」に対応するmbed HRM1017用ファームウェアです。
BLEPropoは、GitHubにて公開中。
https://github.com/lipoyang/BLEPropo
ラジコンは、mbed HRM1017とRCサーボやDCモータを組み合わせて作ります。
Diff: nRF51822/nordic/ble_bondmngr_cfg.h
- Revision:
- 1:48f6e08a3ac2
- Parent:
- 0:8c643bfe55b7
--- /dev/null Thu Jan 01 00:00:00 1970 +0000 +++ b/nRF51822/nordic/ble_bondmngr_cfg.h Wed Aug 20 13:24:20 2014 +0000 @@ -0,0 +1,35 @@ +/* Copyright (c) 2012 Nordic Semiconductor. All Rights Reserved. + * + * The information contained herein is property of Nordic Semiconductor ASA. + * Terms and conditions of usage are described in detail in NORDIC + * SEMICONDUCTOR STANDARD SOFTWARE LICENSE AGREEMENT. + * + * Licensees are granted free, non-transferable use of the information. NO + * WARRANTY of ANY KIND is provided. This heading must NOT be removed from + * the file. + * + */ + + /** @cond To make doxygen skip this file */ + +/** @file + * + * @defgroup ble_sdk_app_gls_bondmngr_cfg GLS Bond Manager Configuration + * @{ + * @ingroup ble_sdk_app_gls + * @brief Definition of bond manager configurable parameters + */ + +#ifndef BLE_BONDMNGR_CFG_H__ +#define BLE_BONDMNGR_CFG_H__ + +/**@brief Number of CCCDs used in the GLS application. */ +#define BLE_BONDMNGR_CCCD_COUNT 2 + +/**@brief Maximum number of bonded centrals. */ +#define BLE_BONDMNGR_MAX_BONDED_CENTRALS 7 + +#endif // BLE_BONDMNGR_CFG_H__ + +/** @} */ +/** @endcond */