Arm V2M-Musca-S1

The Musca-S1 implementation of SSE-200 subsystem deploys two Cortex-M33 processor cores on Samsung Foundry 28FDS and is ready for evaluation of eMRAM-enabled IoT device with secure PSA Root-of-Trust (RoT). Musca-S1 can be used to prototype secure boot, on-chip storage, execution, and network device management through the Keil MDK, TF-M, Mbed OS Arm IoT software stack, and Pelion IoT platform integration. Musca-S1 is PSA Certified Level 1 and PSA Functional API certified.

Overview¶

The digital transformation is underway and driving the need for a new generation of Smart IoT Devices that are both secure and energy-efficient and the foundation to enabling our secure connected world.

Recognizing this need Arm and Samsung Foundry collaborated to create the industry’s 1st PSA Certified Arm-based Smart IoT Device demonstrator called Musca-S1 enabling secure eMRAM-enabled Root of Trust (RoT) and secure Root of Execution (RoE) IoT Device services.

The Musca-S1 dual Arm Cortex-M33 test chip board architecture integrates the recommendations of Platform Security Architecture, (PSA) using the same subsystem as Musca-A, but with the addition of dual embedded MagnetoResistive Random Access Memory (eMRAM) and SRAM on-chip secure memory subsystems

Based on Arm’s Corstone-200 pre-verified subsystem with dual Cortex-M33 processor cores, AMBA AHB5/Trust Zone dual eMRAM and SRAM code memory subsystems, Samsung analogue IPs for control, Cadence and Arm peripheral interface IPs for extended network and cellular connectivity, Musca-S1 provides a series of silicon-proven insights for secure and energy-efficient IoT design on Samsung 28FDS FDSOI silicon.

Musca-S1 test chip demonstrates a combination of on-chip power control, Samsung Foundry’s Reverse Body Biasing (RBB) and eMRAM non-volatile memory power shutdown, allowing for testing and evaluation of new classes of highly energy-efficient, controlled IoT devices.

By combining Arm IP and software solutions on a single board, IoT designers can test and evaluate Arm end-to-end secure IoT solution, showcasing highly energy-efficient and secure IoT at scale. The Musca-S1 test chip board can further reduce costs and time-to-market by giving designers the flexibility to repurpose the reference design for future products.

Board Features¶

The development board contains the following components and systems:

• One Musca‑S1 test chip with CoreLink SSE-200 Subsystem for Embedded. The SSE-200 subsystem includes, but is not limited to, the following:
  • CPU0: One 50MHZ Cortex‑M33 processor. Floating-point unit (FPU), DSP, no coprocessor.
  • CPU1: One 200MHZ Cortex‑M33 processor. FPU, DSP, no coprocessor. Clock system enables operation at ×N speed of CPU0 processor. Body-bias enabled transistors for low-power mode.
  • One 2KB instruction cache and one 2KB data cache for each processor.
  • 4 × 128KB SRAM. One 128KB bank, SRAM3, functions as Tightly Coupled Memory (TCM), Tightly Coupled to CPU1 and operating at CPU1 clock speed.
  • CryptoCell™-312 with 1Kbyte One Time Programming (OTP) emulated using simple registers reset by powerup reset only.
  • Timer, Watchdog peripherals, and system control.
• The following on-chip blocks are outside the SSE-200 subsystem.
  • 2MB Code SRAM.
  • 2×1MB eMRAM.
  • Clock system. Input clock sources from development board.
• Arduino Shield expansion with on-board level converters and a jumper link to enable the Shield voltage to be either the SoC voltage, 1V8, or 3V3. Enables custom designs by providing the following interfaces:
  • UART/USART.
  • I2S, three-channel, master only.
  • SPI.
  • I2C.
  • PWM.
  • 6-channel analog interface from the on-board combined ADC, DAC, and GPIO.
  • 16 1V8 or 3V3 GPIO.
  • 1Hz clock.
• On-board DAPLink that enables the following functionality over USB:
  • Serial Wire Debug (SWD).
  • USB Mass Storage Device (USBMSD) for uploading new firmware.
  • USB serial port. The UART to the DAPLink does not support hardware flow control.
  • Remote reset.
• On-board gyro sensor:
  • MMA7660FC 3-axis orientation and motion detection sensor.
  • I2C interface to test chip.
• On-board combined ADC/DAC/temperature sensor:
  • AD5593.
  • 6-channel 3V3 ADC/DAC/GPIO interface to Arduino Shield.
  • Temperature indicator.
• Programmable boot select:
  • 32MB On-board QSPI boot flash.
  • 2×1MB on-chip boot eMRAM.
  • 2MB on-chip Code SRAM, after being preloaded with execution code.
  • Both Secure and Non‑secure access.
• Debug connector that provides access to:
  • P-JTAG processor debug.
  • Serial Wire Debug (SWD).
  • User push-button:
  • PBON On/Off push-button.
  • nSRST: Cortex-M33 system reset and CoreSight component reset.
  • ISP: Updates DAPLink firmware.
  • RGB LED. Jumper connectors provide optional connections between the Arduino Expansion header and the Musca‑S1 test chip:
  • Red LED connected to GPIO[2] pin, optional PWM0.
  • Green LED connected to GPIO[3] pin, optional PWM1.
  • Blue LED connected to GPIO[4] pin, optional PWM2.
• Status LEDs.
• 5V USB or battery power, selectable by slider switch:
  • DAPLink 5V USB connector.
  • CLN 523450, Lithium Ion, 3.7V, 950mAh (not supplied).

Board Pinout¶

The pinout diagram below shows the Arduino headers signals.

Technical Reference¶

Documentation¶

• Musca-S1 Technical Overview
• Musca-S1 Technical Reference Manual

Interface Firmware¶

Known Issues¶

Please check issues reported on GitHub.

Example applications¶

• mbed-os-example-blinky

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