XNucleoIKS01A3.h

00001 /**
00002  ******************************************************************************
00003  * @file    XNucleoIKS01A3.h
00004  * @author  SRA
00005  * @version V1.0.0
00006  * @date    5-March-2019
00007  * @brief   Header file for class XNucleoIKS01A3 representing a X-NUCLEO-IKS01A3
00008  *          expansion board
00009  ******************************************************************************
00010  * @attention
00011  *
00012  * <h2><center>&copy; COPYRIGHT(c) 2019 STMicroelectronics</center></h2>
00013  *
00014  * Redistribution and use in source and binary forms, with or without modification,
00015  * are permitted provided that the following conditions are met:
00016  *   1. Redistributions of source code must retain the above copyright notice,
00017  *      this list of conditions and the following disclaimer.
00018  *   2. Redistributions in binary form must reproduce the above copyright notice,
00019  *      this list of conditions and the following disclaimer in the documentation
00020  *      and/or other materials provided with the distribution.
00021  *   3. Neither the name of STMicroelectronics nor the names of its contributors
00022  *      may be used to endorse or promote products derived from this software
00023  *      without specific prior written permission.
00024  *
00025  * THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS"
00026  * AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE
00027  * IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE
00028  * DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT HOLDER OR CONTRIBUTORS BE LIABLE
00029  * FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
00030  * DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR
00031  * SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER
00032  * CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY,
00033  * OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE
00034  * OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
00035  *
00036  ******************************************************************************
00037  */
00038 
00039 /* Define to prevent from recursive inclusion --------------------------------*/
00040 #ifndef __X_NUCLEO_IKS01A3_H
00041 #define __X_NUCLEO_IKS01A3_H
00042 
00043 /* Includes ------------------------------------------------------------------*/
00044 #include "mbed.h"
00045 #include "x_nucleo_iks01a3_targets.h"
00046 #include "HTS221Sensor.h"
00047 #include "LIS2DW12Sensor.h"
00048 #include "LIS2MDLSensor.h"
00049 #include "LPS22HHSensor.h"
00050 #include "LSM6DSOSensor.h"
00051 #include "STTS751Sensor.h"
00052 #include "DevI2C.h"
00053 
00054 /* Macros -------------------------------------------------------------------*/
00055 #define CALL_METH(obj, meth, param, ret) ((obj == NULL) ?       \
00056                       ((*(param) = (ret)), 0) : \
00057                       ((obj)->meth(param))      \
00058                       )
00059 
00060 /* Classes -------------------------------------------------------------------*/
00061 /** Class XNucleoIKS01A3 is intended to represent the MEMS Inertial & Environmental
00062  *  Nucleo Expansion Board with the same name.
00063  *
00064  *  The expansion board is featuring basically four IPs:\n
00065  *  -# a HTS221 Relative Humidity and Temperature Sensor\n
00066  *  -# a LPS22HH MEMS Pressure Sensor (and Temperature Sensor)\n
00067  *  -# a STTS751 MEMS Temperature Sensor\n
00068  *  -# a LIS2DW12 3D Acceleromenter\n
00069  *  -# a LIS2MDL 3D Magnetometer\n
00070  *  -# and a LSM6DSO 3D Acceleromenter and 3D Gyroscope\n
00071  *
00072  * The expansion board features also a DIL 24-pin socket which makes it possible
00073  * to add further MEMS adapters and other sensors (e.g. UV index).
00074  *
00075  * It is intentionally implemented as a singleton because only one
00076  * X_NUCLEO_IKS01A3 at a time might be deployed in a HW component stack.\n
00077  * In order to get the singleton instance you have to call class method `Instance()`,
00078  * e.g.:
00079  * @code
00080  * // Inertial & Environmental expansion board singleton instance
00081  * static X_NUCLEO_IKS01A3 *<TODO>_expansion_board = X_NUCLEO_IKS01A3::Instance();
00082  * @endcode
00083  */
00084 class XNucleoIKS01A3 {
00085 protected:
00086     XNucleoIKS01A3(DevI2C *ext_i2c, PinName lsm6dso_int1, PinName lsm6dso_int2, PinName lis2dw12_int1, PinName lps22hh_int, PinName stts751_int);
00087 
00088     ~XNucleoIKS01A3(void)
00089     {
00090         /* should never be called */
00091         error("Trial to delete XNucleoIKS01A3 singleton!\n");
00092     }
00093 
00094 public:
00095     static XNucleoIKS01A3 *instance(DevI2C *ext_i2c = NULL, PinName lsm6dso_int1 = IKS01A3_PIN_LSM6DSO_INT1, PinName lsm6dso_int2 = IKS01A3_PIN_LSM6DSO_INT2, PinName lis2dw12_int1 = IKS01A3_PIN_LIS2DW12_INT1, PinName lps22hh_int = IKS01A3_PIN_LPS22HH_INT, PinName stts751_int = IKS01A3_PIN_STTS751_INT);
00096     static XNucleoIKS01A3 *instance(PinName sda, PinName scl, PinName lsm6dso_int1 = IKS01A3_PIN_LSM6DSO_INT1, PinName lsm6dso_int2 = IKS01A3_PIN_LSM6DSO_INT2, PinName lis2dw12_int1 = IKS01A3_PIN_LIS2DW12_INT1, PinName lps22hh_int = IKS01A3_PIN_LPS22HH_INT, PinName stts751_int = IKS01A3_PIN_STTS751_INT);
00097 
00098     DevI2C  *dev_i2c;
00099 
00100     HTS221Sensor  *ht_sensor;
00101     LIS2MDLSensor *magnetometer;
00102     LIS2DW12Sensor *accelerometer;
00103     LPS22HHSensor  *pt_sensor;
00104     LSM6DSOSensor *acc_gyro;
00105     STTS751Sensor  *t_sensor;
00106 
00107 private:
00108     static XNucleoIKS01A3 *_instance;
00109 };
00110 
00111 #endif /* __X_NUCLEO_IKS01A3_H */