History

Initial release default tip

2016-09-29, by pangsk [Thu, 29 Sep 2016 15:33:32 +0000] rev 9

Initial release

Prefer the same changes from git

2016-04-08, by Jonathan Austin [Fri, 08 Apr 2016 15:11:33 +0100] rev 8

Prefer the same changes from git

Synchronized with git rev 85dd2e7a

2016-04-08, by LancasterUniversity [Fri, 08 Apr 2016 15:10:53 +0100] rev 7

Synchronized with git rev 85dd2e7a
Author: James Devine
nrf51-sdk: removed unneccessary files from the nrf51-sdk repository, for mbed 2.0 compatability

Delete additional system_nrf51.{c,h} files from nrf51-sdk as this confuses the linker when using mbed.org

2016-04-08, by JonnyA [Fri, 08 Apr 2016 00:54:12 +0000] rev 6

Delete additional system_nrf51.{c,h} files from nrf51-sdk as this confuses the linker when using mbed.org

Synchronized with git rev 97f6bff7

2016-04-06, by LancasterUniversity [Wed, 06 Apr 2016 23:55:25 +0100] rev 5

Synchronized with git rev 97f6bff7
Author: James Devine
nrf51-sdk: refined patch to repo and removed debug

This commit removes an unneccessary changed, and also resolves printf statements to DM_LOG statements.

Synchronized with git rev 62ad4f4e

2016-04-06, by LancasterUniversity [Wed, 06 Apr 2016 23:55:25 +0100] rev 4

Synchronized with git rev 62ad4f4e
Author: James Devine
nrf51-sdk : rough first draft of working BLE STACK

added correct IRK matching which softdevice doesn't do correctly.

Fixed whitelisting from adding IRK and Address.

Synchronized with git rev 94c31c8d

2016-04-06, by LancasterUniversity [Wed, 06 Apr 2016 23:55:24 +0100] rev 3

Synchronized with git rev 94c31c8d
Author: James Devine
bonding duplication bug fix

This patch corrects a problem where the bonding table would add a duplicate entry for a device that uses private resolvable addressing.

Synchronized with git rev 762c85be

2016-04-06, by LancasterUniversity [Wed, 06 Apr 2016 23:55:24 +0100] rev 2

Synchronized with git rev 762c85be
Author: Joe Finney
microbit: Increase of maximum bond count from 4 to 6.

Some devices (e.g. Android 4.4.2) consume two entries in the bonding table when
paired. This patch provides some 'headroom' to the effective maximum bond
count of 4 that is employed by microbit-dal.

Synchronized with git rev 2836a891

2016-04-06, by LancasterUniversity [Wed, 06 Apr 2016 23:55:24 +0100] rev 1

Synchronized with git rev 2836a891
Author: Joe Finney
microbit: Update of maximum BLE bond count from 2 to 4.

BLE bond information is stored in a table in flash memory during the pairing process with another BLE device.
This information is required for a secure BLE connection.

There is a limit to the number of entries in this table. It used to be 4 but was recently changed to 2
during a code merge with mbed updates. This patch returns to support four bonds.

Synchronized with git rev 90647e3

2016-04-06, by Jonathan Austin [Wed, 06 Apr 2016 23:55:04 +0100] rev 0

Synchronized with git rev 90647e3