ble_bondmngr_cfg.h

00001 /* Copyright (c) 2012 Nordic Semiconductor. All Rights Reserved.
00002  *
00003  * The information contained herein is property of Nordic Semiconductor ASA.
00004  * Terms and conditions of usage are described in detail in NORDIC
00005  * SEMICONDUCTOR STANDARD SOFTWARE LICENSE AGREEMENT.
00006  *
00007  * Licensees are granted free, non-transferable use of the information. NO
00008  * WARRANTY of ANY KIND is provided. This heading must NOT be removed from
00009  * the file.
00010  *
00011  */
00012 
00013  /** @cond To make doxygen skip this file */
00014  
00015 /** @file
00016  *
00017  * @defgroup ble_sdk_app_gls_bondmngr_cfg GLS Bond Manager Configuration
00018  * @{
00019  * @ingroup ble_sdk_app_gls
00020  * @brief Definition of bond manager configurable parameters
00021  */
00022 
00023 #ifndef BLE_BONDMNGR_CFG_H__
00024 #define BLE_BONDMNGR_CFG_H__
00025 
00026 /**@brief Number of CCCDs used in the GLS application. */
00027 #define BLE_BONDMNGR_CCCD_COUNT            2
00028 
00029 /**@brief Maximum number of bonded centrals. */
00030 #define BLE_BONDMNGR_MAX_BONDED_CENTRALS   7
00031 
00032 #endif // BLE_BONDMNGR_CFG_H__
00033 
00034 /** @} */
00035 /** @endcond */