Wallbot_CaaS
Dependencies: MPU6050 mbed PID
Fork of BLE_MPU6050_test6_challenge_sb by
ble_bondmngr_cfg.h
00001 /* Copyright (c) 2012 Nordic Semiconductor. All Rights Reserved. 00002 * 00003 * The information contained herein is property of Nordic Semiconductor ASA. 00004 * Terms and conditions of usage are described in detail in NORDIC 00005 * SEMICONDUCTOR STANDARD SOFTWARE LICENSE AGREEMENT. 00006 * 00007 * Licensees are granted free, non-transferable use of the information. NO 00008 * WARRANTY of ANY KIND is provided. This heading must NOT be removed from 00009 * the file. 00010 * 00011 */ 00012 00013 /** @cond To make doxygen skip this file */ 00014 00015 /** @file 00016 * 00017 * @defgroup ble_sdk_app_gls_bondmngr_cfg GLS Bond Manager Configuration 00018 * @{ 00019 * @ingroup ble_sdk_app_gls 00020 * @brief Definition of bond manager configurable parameters 00021 */ 00022 00023 #ifndef BLE_BONDMNGR_CFG_H__ 00024 #define BLE_BONDMNGR_CFG_H__ 00025 00026 /**@brief Number of CCCDs used in the GLS application. */ 00027 #define BLE_BONDMNGR_CCCD_COUNT 2 00028 00029 /**@brief Maximum number of bonded centrals. */ 00030 #define BLE_BONDMNGR_MAX_BONDED_CENTRALS 7 00031 00032 #endif // BLE_BONDMNGR_CFG_H__ 00033 00034 /** @} */ 00035 /** @endcond */
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